Endless Diamond Wire Saws, Diamond Multi-Wire Saws and Custom Cutting Solutions for Semiconductor, Ceramics, Optics, PV and Advanced Materials.
Application
Optimal Solution Consultation
ewirexon is your partner for endless diamond wire saws and precision brittle – material cutting solutions that set industry standards.
We have decades of experience in the development and manufacture of advanced cutting machinery.
We rely on close and cooperative collaboration with our customers from a wide range of high – end industries.
Many clients worldwide — including many global market leaders — place their trust in solutions made by ewirexon.
The ewirexon brand, rooted in professional R&D and manufacturing, is internationally established.
Global service centers and local technical partners ensure optimum on – site support, while our mature supply chain enables efficient logistics and fast worldwide delivery.
How about a little more? In addition to our complete standard range of diamond wire cutting machines, precisely tailored to the requirements of different industries, the profound expertise and decades of experience of our specialists in precision machining, material research, process optimization, production technology and project management are fully available to you. As part of our Service Solutions, ewirexon offers you extra support including technical training for operation and maintenance, analysis and optimization of your existing cutting processes, custom development of dedicated cutting solutions, on‑site assembly & commissioning, as well as global logistics and after‑sales service.
Co-packaged optics is moving from architecture diagrams into manufacturing programs. In 2026, GlobalFoundries introduced its SCALE optical-module platform, Coherent demonstrated multiple CPO technologies at OFC,
Aluminum nitride is selected for applications where electrical insulation and heat removal must coexist: power-module substrates, RF components, LED packages, heat spreaders and emerging semiconductor
A sapphire wafer can meet an average thickness target and still be expensive to finish. The problem may be a systematic shape deviation that follows
Three hundred millimeter silicon carbide is no longer only a conference-roadmap number. Coherent announced a 300 mm SiC platform milestone in December 2025, and Wolfspeed
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
A diamond wire can continue moving long after it has stopped cutting economically. It may not be broken, alarms may remain clear, and the machine
